EV Group
Advanced Packaging and 3D Interconnect

 

 

 

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GEMINI® Automated Production Wafer Bonder

CEA Liti - MINATEC / Alliance, SiOł bonding,

 pitch ~51m (SOI)

For more information please contact: 3Dinterconnect@EVGroup.com
You would like to enlarge your profit?

-   Void-free bonding with sub-micron to micron-level alignment accuracy

-   Easy conversion to different wafer sizes

-   Modular design with a minimized footprint

EVG GEMINI: The only field-proven automated production wafer bonder for 3D integration in the semiconductor industry designed for processing wafer sizes up to 300mm with maximum flexibility.

Solutions for the semiconductor and related microelectronics industries.

EV Group (EVG) is a world leader in wafer-processing solutions for semiconductor, MEMS and nanotechnology applications. Through its flexible manufacturing model, EVG develops reliable, high-quality, low-cost-of-ownership systems that are easily integrated into customer's fab lines. Key products include wafer bonding, lithography/nanoimprint lithography (NIL), metrology, photoresist coating, cleaning and inspection equipment.

Invent
Innovate
Implement

There are no limits; only limiting thoughts
Innovation is dedication and superior competence
Reliability is the demand. Consistently high, trustworthy
performance is our response

Triple i - the key to your success