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Advanced Packaging and 3D Interconnect |
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© EV Group, ALL RIGHTS RESERVED |
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EVG's GEMINI is the first fully-automated
production wafer bonding system for processing wafers and substrates from100mm - 200mm
or 200mm - 300mm with a field-proven technology from the world leader in wafer bonding.
This production-proven system integrates fully-automated alignment and bonding stations
and is computer-controlled for maximum usability and process controllability. Its capability
of performing all kinds of wafer bonding processes fulfils the production requirements for
Advanced MEMS, Bio MEMS, Optical MEMS, Advanced Packaging, 3D Interconnects and tomorrow's
applications. The GEMINI is the innovative solution for integrating alignment and bonding with
EVG's unique process separation principle.
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GEMINI® Automated Production Wafer Bonder |
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- 3D Lithography - 300mm Back Side Alignment
- Wafer-to-Wafer (W2W) Bonding with Face-to-Face SmartView Alignment
- Chip-to-Wafer (C2W) Bonding with Known Good Dies
- Via Passivation with NanoSpray Coating
- Thin Wafer Processing with Temporary Bonding and Debonding
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Solutions for the semiconductor and related microelectronics industries. |
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You would like to enlarge your profit?
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EV Group (EVG)
is a world leader in wafer-processing solutions
for semiconductor, MEMS and nanotechnology applications.
Through its flexible manufacturing model, EVG develops
reliable, high-quality, low-cost-of-ownership systems that
are easily integrated into customer's fab lines. Key
products include wafer bonding, lithography/nanoimprint
lithography (NIL), metrology, photoresist coating, cleaning
and inspection equipment.
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There are no limits; only limiting thoughts
Innovation is dedication and superior competence
Reliability is the demand. Consistently high, trustworthy
performance is our response
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Triple i - the key to your success
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